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HANBit
HMF8M32M8V
Flash-ROM Module 32MByte (8Mx32Bit), 72Pin-SIMM, 3.3V Design Part No. HMF8M32M8V GENERAL DESCRIPTION
The HMF8M32M8V is a high-speed flash read only memory (FROM) module containing 16,777,216 words organized in a x32bit configuration. The module consists of eight 4M x 8bit FROM mounted on a 72-pin, double -sided, FR4-printed circuit board. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0V flash or EPROM devices. Four chip enable inputs, ,(/CE_1L, /CE_1H, /CE_2L, /CE_2H) are used to enable the module's 16 bits independently. Output enable (/OE) and write enable (/WE) can set the memory input and output. When FROM module is disable condition the module is becoming power standby mode, system designer can get low-power design. All module components may be powered from a single +3.3V DC power supply and all inputs and outputs are TTLcompatible.
PIN ASSIGNMENT FEATURES
PIN w Access time : 90, 120ns w High-density 32MByte design w High-reliability, low-power design w Single + 3.3V 0.3V power supply w Easy memory expansion w All inputs and outputs are TTL-compatible w FR4-PCB design w Low profile 72-pin SIMM w Minimum 1,000,000 write/erase cycle w Sectors erase architecture w Sector group protection w Temporary sector group unprotection 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Symbol Vss /RESET DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 Vcc DQ7 /CE_1L /CE_2L DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 NC NC DQ16 PIN 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Symbol DQ17 DQ18 DQ19 DQ20 DQ21 Vcc DQ22 DQ23 /CE_1H /CE_2H DQ24 DQ25 DQ26 DQ27 Vss DQ28 DQ29 DQ30 DQ31 NC NC Vcc A19 /OE PIN 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 Symbol /WE A18 A17 A16 A15 A14 A13 A12 A11 A10 Vcc A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 A20 A21 Vss
OPTIONS
w Timing 90ns access 120ns access
MARKING
-90 -120
16 17 18 19 20
w Packages 72-pin SIMM M
21 22 23 24
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FUNCTIONAL BLOCK DIAGRAM
HMF8M32M8V
DQ0 - DQ31 A1 - A21 A0 /CE_1L
32 21 A0-20 DQ15/A-1 DQ 0-7 /OE DQ 0-7 /CE /CE_2L
A0-20 DQ15/A-1 /CE /OE /WE RY-BY /RESET
U1
/WE RY-BY /RESET
U5
/CE_1L
A0-20 DQ15/A-1 /CE DQ 8-15 /OE /WE RY-BY /RESET
A0-20 DQ15/A-1 /OE DQ 8-15 /CE /CE_2L
U2
/WE RY-BY /RESET
U6
A0-20 DQ15/A-1 /CE_1H /CE /OE /WE RY-BY /RESET DQ16-23
A0-20 DQ15/A-1 DQ16-23 /OE /CE /CE_2H /WE RY-BY /RESET
U3
U7
A0-20 DQ15/A-1 /CE_1H /OE /WE /RESET /CE /OE /WE RY-BY /RESET DQ24-31
A0-20 DQ15/A-1 /OE DQ24-31 /CE /CE_2H
U4
/WE RY-BY /RESET
U8
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TRUTH TABLE
MODE STANDBY NOT SELECTED READ WRITE or ERASE NOTE: X means don't care /OE X H L X /CE H L L L /WE X H H L /RESET Vcc0.3V H H H
HMF8M32M8V
DQ ( /BYTE=L ) HIGH-Z HIGH-Z DOUT DIN
POWER STANDBY ACTIVE ACTIVE ACTIVE
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage with respect to ground all other pins Voltage with respect to ground Vcc Power dissipation Storage Temperature SYMBOL VIN,OUT VCC PD TSTG RATING -0.5V to Vcc+0.5V -0.5V to +4.0V 8W -65oC to +150oC
Operating Temperature TA 0oC to + 70oC w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER Vcc for 10% device Supply Voltages Ground SYMBOL Vcc VSS MIN 2.7V 0 0 TYP. MAX 3.6V 0
DC AND OPERATING CHARACTERISTICS ( 0oC TA 70 oC )
PARAMETER TEST CONDITIONS Vcc=Vcc max, VIN= VSS to Input Load Current Vcc Vcc=Vcc max, VOUT= VSS to Output Leakage Current Vcc Output High Voltage Output Low Voltage Vcc Active Read Current (1) /OE = VIH, Vcc Active Write Current (2) Vcc Standby Current Low Vcc Lock-Out Voltage Notes: /CE = VIL, /OE=VIH /CE, /RESET=Vcc0.3V 1MHZ ICC2 ICC3 VLKO 2.3 IOH = -2.0mA, Vcc = Vcc min IOL = 4.0mA, Vcc =Vcc min /CE = VIL, 5MHZ ICC1 16 120 1.6 32 240 40.0 2.5 mA A V VOH VOL 80 0.85 Vcc 0.45 128 mA IL0 IL1 SYMBOL MIN TYP MAX 1.0 UNIT A
1.0
A V V
1. The Icc current listed is typically less than 2mA/MHz, with /OE at VIH. 2. Icc active while embedded algorithm (program or erase) is in progress
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3. Maximum Icc current specifications are tested with Vcc=Vcc max
HMF8M32M8V
ERASE AND PROGRAMMING PERFORMANCE
LIMITS PARAMETER MIN. Sector Erase Time Chip Erase Time Byte Programming Time Chip Programming Time TYP. 0.7 49 9 36 300 108 MAX. 15 sec sec s sec Excludes system-level overhead Excludes 00H programming prior to erasure UNIT COMMENTS
TSOP CAPACITANCE
PARAMETER SYMBOL CIN COUT CIN2 PARAMETER DESCRIPTION Input Capacitance Output Capacitance Control Pin Capacitance
o
TEST SETUP VIN = 0 VOUT = 0 VIN = 0
TYP. 6 8.5 7.5
MAX 7.5 12 9
UNIT pF pF pF
Notes : Test conditions TA = 25 C, f=1.0 MHz.
AC CHARACTERISTICS u Read Only Operations Characteristics
PARAMETER SYMBOLS DESCRIPTION JEDEC STANDARD tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tRC tACC tCE tOE tDF tDF tQH Read Cycle Time Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay Chip Enable to Output High-Z Output Enable to Output High-Z Output Hold Time From Addresses, /CE or /OE, Whichever Occurs First /CE = VIL /OE = VIL /OE = VIL Min Max Max Max Max Max Min TEST SETUP -90 90 90 90 35 30 30 0 -120 120 120 120 50 30 30 ns ns ns ns ns ns ns Speed Options UNIT
TEST SPECIFICATIONS
TEST CONDITION Output load Output load capacitance,CL (Including jig capacitance) Input rise and fall times Input pulse levels Input timing measurement reference levels Output timing measurement reference levels 30 5 0.0-3.0 1.5 1.5 90 1TTL gate 100 pF ns V V V 120 UNIT
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3.0V
HMF8M32M8V
2.7k Device Under Test CL IN3064 or Equivalent
6.2k
Diodes = IN3064 or Equivalent
Note : CL = 100pF including jig capacitance
u Erase/Program Operations
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 tVCS Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Vcc set up time Min Min Min Min Min Min Min Min Min Min Min Typ Typ Min 35 30 9 0.7 50 45 45 0 0 0 0 0 50 90 90 0 50 50 120 120 ns ns ns ns ns ns ns ns ns ns ns s sec s Speed Options UNIT
Notes : 1 . This does not include the preprogramming time 2 . This timing is only for Sector Protect operations
u Erase/Program Operations
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Alternate /CE Controlled Writes
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Min Min Min Min Min Min Min Min Min Min Min Typ Typ 35 45 45 -90 90
HMF8M32M8V
Speed Options UNIT 120 120 0 50 50 0 0 0 0 0 50 30 9 0.7 ns ns ns ns ns ns ns ns ns ns ns s sec
Notes : 1. This does not include the preprogramming time 2 . This timing is only for Sector Protect operations
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u READ OPERATIONS TIMING
HMF8M32M8V
u RESET TIMING
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u PROGRAM OPERATIONS TIMING
HMF8M32M8V
u CHIP/SECTOR ERASE OPERATION TIMINGS
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u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
HMF8M32M8V
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
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u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
HMF8M32M8V
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
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PACKAGE DIMENSIONS
(UNIT : mm)
HMF8M32M8V
0.25 mm MAX
2.54 mm MIN
1.270.08 mm
1.27
Gold: 1.040.10 mm Solder: 0.9140.10 mm
(Solder & Gold Plating)
ORDERING INFORMATION
Component Number 8EA 8EA
Part Number
Density
Org.
Package
Vcc
SPEED
HMF8M32M8V-90 HMF8M32M8V-120
32MByte 32MByte
8Mx 32bit 8Mx 32bit
72Pin -SIMM 72Pin -SIMM
3.3V 3.3V
90ns 120ns
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